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PH

Peng He

Electric Power Research Institute US

0000-0002-5175-5134

620

Publications

12,617

Citations

57

H-Index

284

i10-Index

6.63

2yr Mean Cite

-

Cite/Paper

Data combined from OpenAlex + Semantic Scholar. OA = OpenAlex S2 = Semantic Scholar

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Publication & Citation Trends

Most Cited Works

A highly sensitive and flexible pressure sensor with electrodes and elastomeric interlayer containing silver nanowires

Jun Wang, Jinting Jiu, Masaya Nogi, Tohru Sugahara, Shijo Nagao +3 more

Nanoscale 2014

292

The CMT short-circuiting metal transfer process and its use in thin aluminium sheets welding

Jicai Feng, Hongtao Zhang, Peng He

Materials & Design (1980-2015) 2008

256

Investigation of welding crack in micro laser welded NiTiNb shape memory alloy and Ti6Al4V alloy dissimilar metals joints

Yuhua Chen, Mao Yuqing, Weiwei Lü, Peng He

Optics & Laser Technology 2017

250

The arc characteristics and metal transfer behaviour of cold metal transfer and its use in joining aluminium to zinc-coated steel

H.T. Zhang, Feng Ji, Peng He, B.B. Zhang, J.M. Chen +1 more

Materials Science and Engineering A 2008

242

Microstructural Evolution and Mechanical Properties of Inconel 625 Alloy during Pulsed Plasma Arc Deposition Process

Fujia Xu, Yaohui Lv, Yuxin Liu, Fengyuan Shu, Peng He +1 more

Journal of Material Science and Technology 2013

236

Publications

620 total

Eutectic high-entropy alloys and their applications in materials processing engineering: A review

Jinhong Liu, Zihan Li, Danyang Lin, Zhengxin Tang, Xiaoguo Song et al. - Journal of Material Science and Technology, 2024

Cited by 179 OpenAlex

In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

Jinhong Liu, Jianhao Xu, Kyung‐Wook Paik, Peng He, Shuye Zhang - Journal of Material Science and Technology, 2023

Cited by 132 OpenAlex

Preparation and application of novel microcapsules ruptured by microwave for self-healing concrete

Ying Li, Jianying Yu, Zhilong Cao, Pengao He, Quantao Liu - Unknown Venue, 2021

Cited by 51 Semantic Scholar

Vibration attenuation behaviors of finite sandwich plates with periodic core

Chaojun Jiang, Yang Xiang, Pengao He, Hui He - Unknown Venue, 2020

Cited by 16 Semantic Scholar

Reliability issues of lead-free solder joints in electronic devices PDF

Nan Jiang, Liang Zhang, Zhi‐Quan Liu, Lei Sun, Weimin Long et al. - Science and Technology of Advanced Materials, 2019

Cited by 216 OpenAlex

Recent advances in nano-materials for packaging of electronic devices

Shuye Zhang, Xiangyu Xu, Tiesong Lin, Peng He - Journal of Materials Science Materials in Electronics, 2019

Cited by 141 OpenAlex

Experimental study on premixed flame combustion of annular burner with CO2 dilution based on OH-PLIF technology OA

Zhonghua Wang, Qiang Tang, Zhongqing Yang, Pengao He - Cogent Engineering, 2019

Cited by 0 Semantic Scholar

Study on prediction methods and characteristics of ship underwater radiated noise within full frequency

Bo Zhang, Yang Xiang, Pengao He, Guanxing Zhang - Ocean Engineering, 2019

Cited by 35 Semantic Scholar

High Crystal Quality 2D Manganese Phosphorus Trichalcogenide Nanosheets and their Photocatalytic Activity PDF

Tofik Ahmed Shifa, Fengmei Wang, Zhongzhou Cheng, Peng He, Yang Liu et al. - Advanced Functional Materials, 2018

Cited by 149 OpenAlex

Numerical Simulation of Fluid-Structure Interaction of Anisotropic Composite Propeller

Pengao He, Zi-ru Li, Wei He, Ling Zhu - Unknown Venue, 2018

Cited by 0 Semantic Scholar

Research Topics

Advanced ceramic materials synthesis (123) Intermetallics and Advanced Alloy Properties (96) Advanced materials and composites (90) Aluminum Alloys Composites Properties (82) Electronic Packaging and Soldering Technologies (79)

Frequent Co-Authors

SH

Shuye Zhang

3 joint publications

JI

Jinting Jiu

2 joint publications

MA

Masaya Nogi

2 joint publications

TO

Tohru Sugahara

2 joint publications

SH

Shijo Nagao

2 joint publications

HI

Hirotaka Koga

2 joint publications

Affiliations

North Sichuan Medical University

CN 2024 - 2024

University of Notre Dame

US 2020 - 2018

Harbin University

CN 2019 - 2018

Semiconductor Manufacturing International (Italy)

IT 2013 - 2011

Electric Power Research Institute

US 2025 - 2018

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