Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(62)
3D IC and TSV technologies
(38)
Aluminum Alloys Composites Properties
(30)
Advanced Welding Techniques Analysis
(19)
Intermetallics and Advanced Alloy Properties
(13)
Affiliations
Xi'an University of Science and Technology
Jiangsu Normal University
Harbin Engineering University
Chongqing University
University of California, Los Angeles