Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(25)
Aluminum Alloys Composites Properties
(16)
3D IC and TSV technologies
(16)
Silicon Carbide Semiconductor Technologies
(14)
Advanced Welding Techniques Analysis
(12)
Affiliations
Stevens Institute of Technology
Tokyo Institute of Technology
Jiangsu Normal University
Pohang University of Science and Technology
Jilin Normal University