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LS

Lei Sun

Central South University CN

0000-0003-0261-0673

92

Publications

2,456

Citations

26

H-Index

41

i10-Index

4.91

2yr Mean Cite

-

Cite/Paper

Data combined from OpenAlex . OA = OpenAlex S2 = Semantic Scholar

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Publication & Citation Trends

Most Cited Works

Reliability issues of lead-free solder joints in electronic devices OA

Nan Jiang, Liang Zhang, Zhi‐Quan Liu, Lei Sun, Weimin Long +3 more

Science and Technology of Advanced Materials 2019

216

Nitrogen and boron doped monolayer graphene by chemical vapor deposition using polystyrene, urea and boric acid

Tianru Wu, Honglie Shen, Lei Sun, Bin Cheng, Bin Liu +1 more

New Journal of Chemistry 2012

212

Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints

Lei Sun, Minghe Chen, Liang Zhang

Journal of Alloys and Compounds 2019

165

Structure and properties of Sn-Cu lead-free solders in electronics packaging OA

Meng Zhao, Liang Zhang, Zhi‐Quan Liu, Mingyue Xiong, Lei Sun

Science and Technology of Advanced Materials 2019

134

Recent progress in SLID bonding in novel 3D-IC technologies

Lei Sun, Minghe Chen, Liang Zhang, Peng He, Lansheng Xie

Journal of Alloys and Compounds 2019

125

Publications

92 total

Integration of Ni Doping and a Mo<sub>2</sub>C/MoC Heterojunction for Hydrogen Evolution in Acidic and Alkaline Conditions

Changhai Liu, Lei Sun, Linlin Luo, Wenchang Wang, Huilong Dong et al. - ACS Applied Materials & Interfaces, 2021

Cited by 64 OpenAlex

Hollow Multi‐Shelled V<sub>2</sub>O<sub>5</sub> Microstructures Integrating Multiple Synergistic Resonances for Enhanced Semiconductor SERS

Wei Ji, Linfang Li, Jing Guan, Ming Mu, Wei Song et al. - Advanced Optical Materials, 2021

Cited by 61 OpenAlex

Enhanced electrocatalytic activity of PtCu bimetallic nanoparticles on CeO2/carbon nanotubes for methanol electro-oxidation

Changhai Liu, Lili Zhang, Lei Sun, Wenchang Wang, Zhidong Chen - International Journal of Hydrogen Energy, 2020

Cited by 63 OpenAlex

Reliability issues of lead-free solder joints in electronic devices PDF

Nan Jiang, Liang Zhang, Zhi‐Quan Liu, Lei Sun, Weimin Long et al. - Science and Technology of Advanced Materials, 2019

Cited by 216 OpenAlex

Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints

Lei Sun, Minghe Chen, Liang Zhang - Journal of Alloys and Compounds, 2019

Cited by 165 OpenAlex

Structure and properties of Sn-Cu lead-free solders in electronics packaging PDF

Meng Zhao, Liang Zhang, Zhi‐Quan Liu, Mingyue Xiong, Lei Sun - Science and Technology of Advanced Materials, 2019

Cited by 134 OpenAlex

Recent progress in SLID bonding in novel 3D-IC technologies

Lei Sun, Minghe Chen, Liang Zhang, Peng He, Lansheng Xie - Journal of Alloys and Compounds, 2019

Cited by 125 OpenAlex

Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

Mingyue Xiong, Liang Zhang, Lei Sun, Peng He, Weimin Long - Vacuum, 2019

Cited by 78 OpenAlex

Effect of nano-Al addition on properties and microstructure of low-Ag content Sn–1Ag–0.5Cu solders

Lei Sun, Liang Zhang, Le Xu, Sujuan Zhong, Jia Ma et al. - Journal of Materials Science Materials in Electronics, 2016

Cited by 59 OpenAlex

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging PDF

Lei Sun, Liang Zhang - Advances in Materials Science and Engineering, 2015

Cited by 79 OpenAlex

Research Topics

Electronic Packaging and Soldering Technologies (52) 3D IC and TSV technologies (36) Aluminum Alloys Composites Properties (24) Advanced Welding Techniques Analysis (12) Intermetallics and Advanced Alloy Properties (11)

Frequent Co-Authors

LI

Liang Zhang

4 joint publications

PE

Peng He

3 joint publications

MI

Mingyue Xiong

3 joint publications

LI

Liang Zhang

3 joint publications

CH

Chao Gao

3 joint publications

HO

Honglie Shen

3 joint publications

Affiliations

Jiangsu Normal University

CN 2016 - 2014

Electric Power Research Institute

US 2019 - 2019

Central South University

CN 2025 - 2025

Shandong University

CN 2021 - 2021

Harbin Institute of Technology

CN 2025 - 2025

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