Zhi‐Quan Liu
0000-0001-7097-8977
Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(136)
3D IC and TSV technologies
(80)
Intermetallics and Advanced Alloy Properties
(43)
Copper Interconnects and Reliability
(41)
Electrodeposition and Electroless Coatings
(37)
Affiliations
Tongji University
University of Science and Technology of China
Shanghai Medical College of Fudan University
Okayama University of Science
Loughborough University