Find My Journal

HL

Hwa-Teng Lee

National Cheng Kung University TW

18

Publications

372

Citations

9

H-Index

9

i10-Index

2.0

2yr Mean Cite

-

Cite/Paper

Data combined from OpenAlex . OA = OpenAlex S2 = Semantic Scholar

Verify on Google Scholar

Publication & Citation Trends

Most Cited Works

Influence of intermetallic compounds on the adhesive strength of solder joints

Hwa-Teng Lee, Ming-Hung Chen

Materials Science and Engineering A 2002

128

Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints

Hwa-Teng Lee, Ming-Hung Chen, Huei-Mei Jao, Chin-Jui Hsu

Journal of Electronic Materials 2004

56

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Hwa-Teng Lee, Yin-Fa Chen

Journal of Alloys and Compounds 2010

47

Effects of Cooling Rate on the Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder

Hwa-Teng Lee, Kuo-Chen Huang

Journal of Electronic Materials 2015

31

Fine Grains Forming Process, Mechanism of Fine Grain Formation and Properties of Superalloy 718 OA

Hwa-Teng Lee, Wen-Hsin Hou

MATERIALS TRANSACTIONS 2012

22

Publications

18 total

Effect of Double Pulse Resistance Spot Welding Process on 15B22 Hot Stamped Boron Steel PDF

Hwa-Teng Lee, Yuan‐Chih Chang - Metals, 2020

Cited by 17 OpenAlex

Enhanced Cell Proliferation on Biomedical Titanium Surfaces by Laser Ablation-Induced Micro- and Nanoscale Hybrid Structures PDF

Hwa-Teng Lee, Ching-Chi Lin - MATERIALS TRANSACTIONS, 2019

Cited by 7 OpenAlex

The Influence of Mg-Based Inclusions on the Grain Boundary Mobility of Austenite in SS400 Steel PDF

Chih-Ting Lai, Hsuan-Hao Lai, Yen-Hao Su, Fei-Ya Huang, Chi-Kang Lin et al. - Metals, 2019

Cited by 4 OpenAlex

Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu

Hwa-Teng Lee, Kuo-Chen Huang - Journal of Electronic Materials, 2016

Cited by 12 OpenAlex

Effects of Cooling Rate on the Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder

Hwa-Teng Lee, Kuo-Chen Huang - Journal of Electronic Materials, 2015

Cited by 31 OpenAlex

Application and Characteristics of Low-Carbon Martensitic Stainless Steels on Turbine Blades PDF

Hwa-Teng Lee, Feng-Ming Liu, Wun-Hsin Hou - MATERIALS TRANSACTIONS, 2015

Cited by 4 OpenAlex

Fine Grains Forming Process, Mechanism of Fine Grain Formation and Properties of Superalloy 718 PDF

Hwa-Teng Lee, Wen-Hsin Hou - MATERIALS TRANSACTIONS, 2012

Cited by 22 OpenAlex

Influence of Precipitated Phase Formation on Recrystallization Behavior of Superalloy 718 PDF

Hwa-Teng Lee, Wen-Hsin Hou - MATERIALS TRANSACTIONS, 2012

Cited by 3 OpenAlex

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Hwa-Teng Lee, Yin-Fa Chen - Journal of Alloys and Compounds, 2010

Cited by 47 OpenAlex

Magnetostriction and magnetic structure in annealed recrystallization of strain-forged ferromagnetic shape memory Fe–Pd–Rh alloys

Yin-Chih Lin, Hwa-Teng Lee - Journal of Applied Physics, 2010

Cited by 4 OpenAlex

Research Topics

Electronic Packaging and Soldering Technologies (6) 3D IC and TSV technologies (6) Microstructure and Mechanical Properties of Steels (4) Advanced Welding Techniques Analysis (4) Metallurgy and Material Forming (4)

Frequent Co-Authors

MI

Ming-Hung Chen

2 joint publications

YI

Yin-Fa Chen

2 joint publications

KU

Kuo-Chen Huang

2 joint publications

WE

Wen-Hsin Hou

2 joint publications

HU

Huei-Mei Jao

1 joint publication

CH

Chin-Jui Hsu

1 joint publication

Affiliations

National Cheng Kung University

TW 2025 - 2002

External Profiles

OpenAlex Profile Search Semantic Scholar Google Scholar

Share Profile

Back to Researchers