Publication & Citation Trends
Most Cited Works
Publications
13 total
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
Cited by 1
OpenAlex
3D numerical study of effects of temperature field on sensitisation of Alloy 690 butt welds fabricated by gas tungsten arc welding and laser beam welding
Cited by 12
OpenAlex
Effects of Deagglomeration and Zirconia Wear Debris on Sintering Behavior of α‐Alumina Powder
Cited by 1
OpenAlex
Influence of Cu addition on intermetallic compound formation and microstructure of Sn–3Ag–1˙5Sb–<i>x</i>Cu solder joints
Cited by 3
OpenAlex
An Enhanced Calibration Scheme for the EDM Hole-Drilling Strain Gage Method for the Measurement of Residual Stress in Ferrous Materials PDF
Cited by 2
OpenAlex
Microstructual Study of the Dissimilar Joints of Alloy 690 and SUS 304L Stainless Steel PDF
Cited by 27
OpenAlex
Research Topics
Welding Techniques and Residual Stresses
(4)
Fatigue and fracture mechanics
(3)
Electronic Packaging and Soldering Technologies
(3)
Advanced Welding Techniques Analysis
(3)
3D IC and TSV technologies
(3)
Frequent Co-Authors
Affiliations
National Cheng Kung University