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IEEE Transactions on Components Packaging and Manufacturing Technology

Established Impact

About IEEE Transactions on Components Packaging and Manufacturing Technology

IEEE Transactions on Components Packaging and Manufacturing Technology is a peer-reviewed academic journal published by Institute of Electrical and Electronics Engineers.

Editorial Perspective & Metric Analysis

Based on current metadata, IEEE Transactions on Components Packaging and Manufacturing Technology maintains a competitive position in the US academic market. With an impact factor of 2.11, it remains a steady venue for researchers in its specific sub-fields.

ISSN (Print) 2156-3950
ISSN (Online) 2156-3985
Publisher Institute of Electrical and Electronics Engineers
Country United States
APC / Cost Inquire with Publisher
About IEEE Transactions on Components Packaging and Manufacturing Technology

IEEE Transactions on Components Packaging and Manufacturing Technology is a peer-reviewed academic journal published by Institute of Electrical and Electronics Engineers.

IEEE Transactions on Components Packaging and Manufacturing Technology is published by Institute of Electrical and Electronics Engineers from US as a journal. It has published 5,085 works to date, attracting 59,272 citations across the literature. The journal carries an h-index of 77, reflecting both depth of catalog and sustained citation impact. Recent publishing activity centers on Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Microwave Engineering and Waveguides.
Frequently Asked Questions about IEEE Transactions on Components Packaging …

The current impact factor of IEEE Transactions on Components Packaging and Manufacturing Technology is 2.110.

No, IEEE Transactions on Components Packaging and Manufacturing Technology is not an open access journal.

IEEE Transactions on Components Packaging and Manufacturing Technology is published by Institute of Electrical and Electronics Engineers.
Live Indexing Status
Updated April 2026

Track real-time indexing metrics to ensure this journal meets your academic requirements.

OpenAlex
Verified
DOAJ
Non-OA
Predatory Check
Clean
Impact Factor
2.110
Current Impact Factor
Historical Trend
Initial data points only
Impact Factors by Year
Year Value Source
2025 2.110 CiteScore (Scopus)
Works Published per Year (2014–2025)

Annual publication volume sourced from OpenAlex. Current year omitted (partial data).

Journal at a Glance
5,085
Total Works
59,272
Total Citations
77
h-index
2.11
2-Yr Mean Citedness

Source: OpenAlex — refreshed daily.

Top Research Topics

The areas where IEEE Transactions on Components Packaging … most frequently publishes, ranked by article volume.

  1. Electronic Packaging and Soldering Technologies
    Engineering
    1,572 works
  2. 3D IC and TSV technologies
    Engineering
    1,299 works
  3. Microwave Engineering and Waveguides
    Engineering
    614 works
  4. Electromagnetic Compatibility and Noise Suppression
    Engineering
    611 works
  5. Advanced Antenna and Metasurface Technologies
    Engineering
    331 works
  6. Heat Transfer and Optimization
    Engineering
    257 works
  7. Silicon Carbide Semiconductor Technologies
    Engineering
    254 works
  8. Radio Frequency Integrated Circuit Design
    Engineering
    238 works
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Metadata

Last updated: Apr 24, 2026

Updated by: openalex_bulk

OpenAlex ID: S50222406
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