XW

Xiaofeng Wang

Guizhou University CN

1
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Data combined from OpenAlex + Semantic Scholar. OA = OpenAlex S2 = Semantic Scholar
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Publications

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The Study of Thermally Induced Warpage of BGA Package during Reflow Soldering

Yao Bin, Wang Xiaofeng, Zou Yabing - International Conference on Electronic Packaging Technology, 2018
Cited by 8 Semantic Scholar

Research Topics

Genomics and Phylogenetic Studies (1) Histone Deacetylase Inhibitors Research (1) Biological and pharmacological studies of plants (1)

Affiliations

Guizhou University
CN 2026 - 2026

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