Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(22)
Structural Behavior of Reinforced Concrete
(15)
3D IC and TSV technologies
(15)
Structural Response to Dynamic Loads
(8)
Seismic Performance and Analysis
(7)
Affiliations
Tongji University
University of Electronic Science and Technology of China
Dalian University of Technology
Guangzhou Research Institute of Non-ferrous Metals
Shanghai Research Institute of Building Sciences (China)