XW

Xiaofeng Wang

Virginia Tech US

ORCID 0000-0002-3850-3274
172
Publications
3,260
Citations
30
H-Index
60
i10-Index
5.25
2yr Mean Cite
-
Cite/Paper
Data combined from OpenAlex + Semantic Scholar. OA = OpenAlex S2 = Semantic Scholar
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Publication & Citation Trends

Publications

0 total

The Study of Thermally Induced Warpage of BGA Package during Reflow Soldering

Yao Bin, Wang Xiaofeng, Zou Yabing - International Conference on Electronic Packaging Technology, 2018
Cited by 8 Semantic Scholar

Research Topics

Plant Virus Research Studies (42) RNA Research and Splicing (11) MicroRNA in disease regulation (8) CRISPR and Genetic Engineering (8) Cancer-related molecular mechanisms research (7)

Affiliations

South China Agricultural University
CN 2012 - 2012
Qingdao University
CN 2019 - 2010
Nanjing Agricultural University
CN 2009 - 2009
Chongqing Normal University
CN 2023 - 2023
Union Hospital
CN 2019 - 2011

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