Hui Wang
0000-0003-4861-8144
Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Mechanical Behavior of Composites
(36)
Electronic Packaging and Soldering Technologies
(12)
Perovskite Materials and Applications
(9)
Epoxy Resin Curing Processes
(9)
3D IC and TSV technologies
(9)
Affiliations
Shanghai University
Hunan University of Science and Technology
Zhejiang A & F University
Oak Ridge National Laboratory
Tianjin University of Science and Technology