Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
3D IC and TSV technologies
(87)
Electronic Packaging and Soldering Technologies
(56)
Photonic and Optical Devices
(35)
Semiconductor materials and devices
(25)
Electrochemical sensors and biosensors
(22)
Affiliations
Hebei Agricultural University
Qingdao University
Jiangnan University
Fujian Normal University
Macau University of Science and Technology