Xuejun Fan
0000-0003-0525-4424
Publication & Citation Trends
Publications
0 total
Revealing The Degradation Mechanism of (Sr,Ca)AlSiN3:Eu2+ Phosphor Aged Under Thermal‐Moisture‐Sulfur Conditions: A Combined Experimental and Ab Initio Study OA
Cited by 7
Semantic Scholar
Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration OA
Cited by 15
Semantic Scholar
Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm OA
Cited by 4
Semantic Scholar
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network OA
Cited by 2
Semantic Scholar
Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect OA
Cited by 2
Semantic Scholar
Effect of Thermomigration on Electromigration in SWEAT Structures OA
Cited by 0
Semantic Scholar
Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation OA
Cited by 0
Semantic Scholar
Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation OA
Cited by 9
Semantic Scholar
Implementation of Fully Coupled Electromigration Theory in COMSOL OA
Cited by 7
Semantic Scholar
Research Topics
Electronic Packaging and Soldering Technologies
(165)
3D IC and TSV technologies
(72)
GaN-based semiconductor devices and materials
(58)
Combustion and flame dynamics
(40)
Mechanical Behavior of Composites
(38)
Affiliations
Harbin University of Science and Technology
Hebei University of Engineering
Handan College
RTX (United States)
Philips (Finland)