Hiroshi Nishikawa
0000-0002-4363-9520
Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(289)
3D IC and TSV technologies
(182)
Aluminum Alloys Composites Properties
(86)
Advanced Welding Techniques Analysis
(73)
Intermetallics and Advanced Alloy Properties
(57)
Affiliations
Harbin University of Science and Technology
Otsuka (Japan)
Tokyo Institute of Technology
Jikei University School of Medicine
TEPCO (Japan)