Albert T. Wu
0000-0002-3310-2471
Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(76)
3D IC and TSV technologies
(44)
Copper Interconnects and Reliability
(30)
Intermetallics and Advanced Alloy Properties
(17)
Advanced Thermoelectric Materials and Devices
(15)
Affiliations
Northwestern University
National Taipei University of Technology
Lawrence Berkeley National Laboratory
University of California, Los Angeles
Chinese University of Hong Kong