JournalsHub
.online
Find My Journal
BD

Bo Du

China Mobile (China) CN

ORCID iD 0000-0001-8104-3448
99
Publications
3,796
Citations
27
H-Index
34
i10-Index
1.95
2yr Mean Cite
-
Cite/Paper
Data combined from OpenAlex + Semantic Scholar. OA = OpenAlex S2 = Semantic Scholar
Verify on Google Scholar

Publication & Citation Trends

Publications

0 total

Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters

Hao Zou, Fang Xie, Bo-Sian Du, G. Kavithaa - Soldering & surface mount technology, 2020
Cited by 1 Semantic Scholar

A Composite Structure of Low Dielectric Substrate for 5G mmWave and the Application in Flexible Printed Circuit (FPC)

Wei-Chi Lee, Bo-Sian Du - Impact, 2019
Cited by 2 Semantic Scholar

A composite structure of high frequency low dielectric film and the application in flexible printed circuit (FPC)

Wei-Chi Lee, Bo-Sian Du - Impact, 2016
Cited by 3 Semantic Scholar

22.2: Invited Paper: Flexible Polymer Electrets for Flexible, High‐Performance, Paper‐Like Speakers, and Touch Panel Applications

Dar-Ming Chiang, Jen-Luan Chen, Bo-Sian Du, Chun-Jen Wang, Shu-Ru Lin - Unknown Venue, 2011
Cited by 1 Semantic Scholar

Research Topics

Insect-Plant Interactions and Control (34) Plant Virus Research Studies (19) Plant Parasitism and Resistance (14) Insect Resistance and Genetics (10) Plant-Microbe Interactions and Immunity (7)

Affiliations

Griffith University
AU 2025 - 2025
National Institute of Japanese Literature
JP 2025 - 2024
Xinyang Normal University
CN 2011 - 2011
China Mobile (China)
CN 2026 - 2026
Wuhan University
CN 2025 - 2002

External Profiles

OpenAlex Profile Semantic Scholar Profile ORCID Profile Google Scholar

Share Profile

Back to Researchers
Comparison Shortlist
0 journals
Est. APC Budget: $0
Compare Now