Hongjun Ji
0000-0002-4159-6838
Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(65)
Advanced Welding Techniques Analysis
(40)
3D IC and TSV technologies
(31)
Advanced Sensor and Energy Harvesting Materials
(27)
Aluminum Alloys Composites Properties
(22)
Affiliations
Shenzhen Institute of Information Technology
Shenzhen University
Harbin Institute of Technology
University Town of Shenzhen
Nanjing University of Science and Technology